IEEE COINS 2026

Omni-Layer
Intelligent Systems

IEEE COINS brings together researchers, engineers, and industry leaders to advance next-generation AI and intelligent systems spanning devices, architectures, and applications. It emphasizes cross-layer co-design, energy-efficient and secure computing, and the responsible integration of AI from embedded and edge platforms to agentic and autonomous systems.

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September 7–9, 20263-Day Conference
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University of BolognaBologna, Italy
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Submission DeadlineApril 29, 2026
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12 Technical Tracks4 Clusters · 3 Special Sessions
Submit Your Paper → View Call for Papers Conference Program
Sponsorship

Sponsored & Endorsed By

IEEE COINS 2026 is technically co-sponsored by University of Bologna and IEEE Italy Section and IEEE CS Italy Chapter and IEEE ComSoc Italy Chapter and IEEE RAS and IEEE CEDA and IEEE CAS and IEEE Region 8 and IEEE TCDE and AI4I. Proceedings are published in IEEE Xplore.

University of Bologna IEEE Italy Section IEEE CS Italy Chapter IEEE ComSoc Italy Chapter IEEE RAS IEEE CEDA IEEE CAS IEEE Region 8 IEEE TCDE AI4I
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Submit by April 29, 2026 →
12
Technical Tracks
4
Thematic Clusters
500+
Expected Attendees
50+
Countries Represented
About COINS

Cross-Layer Intelligence from Silicon to Cloud

IEEE COINS brings together researchers, engineers, and industry leaders to advance next-generation AI and intelligent systems spanning devices, architectures, and applications. It emphasizes cross-layer co-design, energy-efficient and secure computing, and the responsible integration of AI from embedded and edge platforms to agentic and autonomous systems.

Explore Tracks Meet the Committee
Enabling Intelligence
Hardware — Design — Architecture
Connected Intelligence
Network — Cloud — IoT
Trusted and Autonomous Intelligence
Security — Agency — Cognition
Human-Aligned and Applied Intelligence
Human — Ethics — Industry
Important Dates

Key Deadlines

Full Paper SubmissionVia EasyChair — double-blind, fully anonymized
April 29, 2026
Open Now
Special Session / Workshop / Tutorial ProposalsVia EasyChair — select the matching proposal track
April 29, 2026
Open Now
Acceptance NotificationAuthors notified of review decisions
June 2, 2026
Upcoming
Camera-Ready SubmissionFinal manuscript and IEEE copyright form
June 29, 2026
Future
ConferenceUniversity of Bologna, Italy
September 7–9, 2026
Future
Full Call for Papers
Venue

University of Bologna, Bologna

COINS 2026 will be held at the historic San Giovanni in Monte Complex at the University of Bologna — one of the world's oldest universities.

Piazza Maggiore, Bologna
Piazza Maggiore, Bologna
Bologna panorama from San Luca
Bologna panorama from San Luca
Torre degli Asinelli
Torre degli Asinelli
University of Bologna
University of Bologna

Bologna is the capital of the Emilia-Romagna region in northern Italy, famous for its mediaeval towers and porticoes (UNESCO World Heritage), vibrant food scene (birthplace of ragu and mortadella), and its university — one of the world's oldest. Excellent rail connections from Milan, Florence, and Rome. September brings warm, pleasant weather ideal for exploring the city between sessions.

Venue & Hotels →
Keynote Speakers

Invited Keynotes

COINS 2026 features 4 keynote lectures from world-leading researchers and innovators.

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Luca Benini
University of Bologna, Italy — ETH Zurich, Switzerland
Monday, September 7, 2026 · 09:00 – 10:00 CEST
Designing Digital Platforms for Wearable Contextual Intelligence
Wearable devices are evolving toward smart, context-aware digital assistants by leveraging rapidly increasing generative AI capabilities on device, at the extreme edge. Running multimodal generative AI models on a wearable device requires tackling major challenges in model distillation, as well as in energy and latency aware hardware-software platform design. In this talk I will explore model-to-chip design for wearable contextual intelligence, focusing on brain inspired heterogeneous computing with multi-domain acceleration.
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Vijay Janapa Reddi
Harvard University, USA
Tuesday, September 8, 2026 · 09:00 – 10:00 CEST
From Omni Layer AI to AI Engineering: Why Intelligent Systems Need a Discipline
AI spans the computing stack from in-memory hardware and chiplets to cloud models, agentic autonomy, and safety deployments. Conferences like COINS unite these layers, yet intellectual foundations fragment: hardware optimizes efficiency, systems scale operations, agentic AI enhances reasoning, responsible AI governs ethics. Lacking cross-layer abstractions and lifecycle evaluations, progress stalls. AI Engineering emerges as the solution, integrating all via shared frameworks, reproducibility, and deployment principles — treating systems as impactful infrastructures. Pillars include abstractions, evaluations, benchmarking, and education. Goal: trustworthy, scalable intelligence. Key question: Can we engineer omni-layer AI responsibly at scale?
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Elisa Ricci
University of Trento — Fondazione Bruno Kessler, Italy
Wednesday, September 9, 2026 · 09:00 – 10:00 CEST
Trustworthy AI
Full abstract to be announced. This keynote will address key challenges and research directions in building trustworthy AI systems — covering fairness, robustness, interpretability, and safe deployment in real-world scenarios.
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Valeria Tomaselli
SW Design Senior Team Leader, STMicroelectronics
Tuesday, September 8, 2026 · 13:00 – 13:45 CEST
Industrial Keynote — TBA
Full details to be announced. Industrial keynote from STMicroelectronics.
All Keynote Details →
Student Travel Grants Available

COINS Executive Committee offers registration grants for highly skilled students with an accepted paper. Competition-based. Applications especially encouraged from the Middle East and Asia. Contact: coins@coinsconf.com