Submission Open

Call for Papers

Original research on intelligent systems spanning hardware, AI, networks, and applications. Deadline: April 23, 2027.

📅 Submission Deadline: April 23, 2027

Complete manuscripts submitted via EasyChair. Double-blind review policy — anonymize your manuscript.

Submission Format

  • ✦ Up to 6 pages (IEEE two-column, 10pt font)
  • ✦ Optional 2 extra pages at $150/page
  • ✦ PDF format only, with savable text
  • ✦ Double-blind — no author names/affiliations
  • ✦ Use IEEE Proceedings Template

Review Process

  • ✦ Blind peer review by multiple reviewers
  • ✦ Criteria: Relevance, Originality, Technical Quality
  • ✦ Full papers: 20+5 min oral presentation
  • ✦ Short papers: 13+2 min oral presentation
  • ✦ Published in IEEE Xplore
Cluster 1 Enabling Intelligence — Hardware — Design — Architecture
Track 1

AI Hardware, Circuits, and Devices

This track explores the physical and circuit-level foundations of intelligent computing. Topics include compute-in-memory (CIM/PIM) and near-sensor computing, mixed-signal and analog MAC design, on-chip learning, low-power digital accelerators, and reliability/variation-tolerant architectures. Contributions on heterogeneous 2.5D/3D integration, chiplet/interposer co-design, photonic and quantum devices, and novel materials for AI computing are encouraged.

CIM/PIMAnalog MACsOn-chip learningChipletsPhotonic AI
Track 2

AI-Driven Design Automation and Optimization

This track focuses on machine-learning-enabled EDA and cross-layer optimization. Topics include predictive PnR and timing closure, reinforcement-learning-guided design-space exploration, generative circuit synthesis, formal verification and test (ATPG), yield and cost modeling, and runtime telemetry-driven optimization. Submissions combining HW/SW co-synthesis with AI-assisted reliability and power-performance-area (PPA) trade-offs are especially welcome.

ML for EDATiming closureFormal verificationHW/SW co-synthesis
Track 3

AI Architectures and Systems Design

This track covers architectural innovations for next-generation AI accelerators and systems. Topics include systolic and dataflow architectures, sparsity/quantization support, NoC/interconnect co-design, HBM/HMC hierarchies, RISC-V and chiplet-based SoCs, compiler/runtime co-optimization, and heterogeneous coherence standards (UCIe). Modeling and evaluation frameworks for scalable inference and training are also encouraged.

AI acceleratorsRISC-VNoC/InterconnectHBM/HMCDataflow
Cluster 2 Connected Intelligence — Network — Cloud — IoT
Track 4

AI-Native Connectivity, Networks, and Distributed Intelligence

This track emphasizes AI-native communication and network intelligence across 6G/7G systems. Topics include semantic and goal-oriented communications, federated and in-network learning, O-RAN RIC (xApps/rApps), integrated sensing, communication, and computation (ISCC), reconfigurable intelligent surfaces (RIS), and digital twins of networks. Research on self-organizing networks, resource allocation, over-the-air aggregation, and field testbeds is encouraged.

6G/7GO-RAN RICFederated learningRIS/ISACSemantic comms
Track 5

Cloud, Infrastructure, and Data-Centric Intelligence

This track addresses AI computing infrastructure and data engineering. Areas include data pipelines, feature stores, vector databases, serverless AI frameworks, LLM serving and inference optimization, virtualization, and sustainability-aware resource management across cloud-edge continua. Work on digital twins for datacenter operations and blockchain-based data provenance is also welcome.

MLOps/LLMOpsVector DBsModel servingDigital twinsAutoscaling
Track 6

Internet of Things (IoT) and Cyber-Physical Intelligence

This track examines the convergence of the Internet of Things (IoT), edge intelligence, and cyber-physical systems (CPS) in creating smart, connected, and autonomous environments. It focuses on intelligent sensing and actuation, embedded and edge AI, TinyML, real-time analytics, and time-sensitive networking (TSN) for low-latency and deterministic communication. Topics also include hardware-in-the-loop (HIL) simulation, functional safety, edge–cloud orchestration, and large-scale interoperability across industrial, urban, and critical infrastructure systems. Submissions addressing digital twins, self-adaptive IoT architectures, industrial wireless technologies, or next-generation IoT protocols are particularly encouraged.

TinyMLTSNCPSEdge-cloudDigital twinsAdaptive IoT
Cluster 3 Trusted and Autonomous Intelligence — Security — Agency — Cognition
Track 7

Secure, Reliable, and Trustworthy AI Systems

This track unifies hardware and AI security for trustworthy intelligent systems. Topics include side-channel and fault-injection attacks, model watermarking and supply-chain security, red-teaming and safety cases, privacy-preserving learning, and runtime attestation of edge or cloud AI. Verification, certified robustness, and governed model lifecycles are also in scope.

AI securityAdversarial robustnessPrivacy (FL/DP/HE)Attestation
Track 8

Agentic and Robotic AI Systems

This track covers autonomous and agentic AI in both software and embodied forms. Topics include SLAM, 3D perception, manipulation and grasping, task and motion planning (TAMP), reinforcement learning for control, shared autonomy, multi-robot coordination, LLM-Enabled Robotic Agents and Embodied AI, Agentic AI Architectures for Autonomous Robots, and sim-to-real transfer. Submissions on safety-critical deployment, benchmarks, and field validation are encouraged.

RoboticsSLAMTAMPMulti-robotSim-to-realEmbodied AI
Track 9

Foundational, Generative, and Cognitive AI

This track spans core algorithmic and model innovations in AI. Topics include foundation and multimodal models (LLMs, VLMs), retrieval-augmented generation (RAG), parameter-efficient fine-tuning (LoRA/QLoRA), reinforcement learning (RL/RLHF/RLAIF), generative design, neurosymbolic reasoning, and cognitive architectures. Work on model efficiency, alignment, verification, and continual learning is encouraged.

LLMs/VLMsRAGLoRA/QLoRARLHFContinual learningAlignment
Cluster 4 Human-Aligned and Applied Intelligence — Human — Ethics — Industry
Track 10

Human-Centered AI, Interaction, and Visualization

This track examines human–AI interfaces and decision support systems. Areas include explainable interfaces, uncertainty and provenance visualization, XR/AR/VR for operations and training, conversational UIs, and human-in-the-loop evaluation with cognitive load and ergonomic analysis. Contributions on trust calibration and safety UX are welcome.

XAIXR/AR/VRHuman-in-the-loopTrust & safety UXProvenance
Track 11

Responsible, Ethical, and Sustainable AI

This track addresses fairness, accountability, and sustainability in AI lifecycles. Topics include risk management, impact assessment, auditing and reporting (model cards/datasheets), governance and policy frameworks, safety certification, and environmental impact analysis of training and inference. Submissions aligned with NIST AI RMF principles are encouraged.

FairnessTransparencyGovernanceSustainabilityRisk management
Track 12

Vertical Applications in Smart Cities, Industry 4.0, Healthcare & Beyond

This track focuses on AI-driven applications and vertical domains that demonstrate real-world impact. Topics include digital medicine and healthcare, Industry 4.0 and predictive manufacturing, process control (fabs/chemicals), smart energy and mobility, grid intelligence, logistics and ports, urban digital twins, and resilient infrastructure. Submissions highlighting cross-domain integration and sustainability are encouraged.

AIoTDigital medicineIndustry 4.0Smart citiesSmart agriculture
Special Special Session Tracks
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Special Session 1

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Special Session 2

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Special Session 3

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Special Session 4

Topic and organizers TBA.

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Special Session 5

Topic and organizers TBA.

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Special Session 6

Topic and organizers TBA.

Submit Paper via EasyChair → Author's Guide